About 6 design conditions of chip inductors?
2020-06-18
Inductors are electromagnetic induction components wound with insulated wires. They are also one of the commonly used components in electronic circuits. SMD inductors are a type of inductors. There are color ring inductors, I-shaped inductors, one-piece inductors, high-frequency inductors and so on.
1. Storage: In order to maintain the solderability of the end surface electrode, such as: temperature and humidity conditions are less than 40 ℃ and 70% RH. It is recommended that ceramic chip inductors should be used within 6 months after delivery. Packaging materials should avoid environments containing chlorine and sulfur.
2. Handling: It is recommended to separate the used tweezers and vacuum components from other components when picking up. Attention should be paid to minimize friction and mechanical shock during bulk handling. The chip ceramic induction is handled carefully to avoid damage and oil pollution from the skin.
3. Pad design: The design of the electrode's welding pad should be able to achieve good welding paint and reduce the movement of components during reflow. The following is the welding pad design for wave soldering or reflow soldering for the most common dust-collecting ceramic sizes. The basics of these designs are as follows: the width of the welding pad is the same as the width of the component. Reducing to 85% of the component width is permissible, but it is not wise to reduce more. The welding pad overlaps the bottom of the component by 0.5mm. For reflow soldering, the welding pad extends 0.5mm beyond the component; for wave soldering it is 1.0mm longer. Component spacing: For wave soldering components, there must be enough spacing to avoid it. The interval is less important for reflow, but there must be enough interval to prevent heavy work.
4. Preheating: It is very important to avoid the possibility of thermal shock during welding, so preheating is necessary. The preheating temperature rise should not exceed 4°C
c, and the recommended value is 2°Cc. Although a temperature difference of 80°C to 120°C is common, recent studies have shown that for a 1210 size component with a thickness of less than 1.25mm, the difference between the surface temperature of the component and the soldering temperature of up to 150°C is feasible. Users should be aware that thermal shock will increase as the component size or temperature increases.
5. The selection of flux: Since the flux returning to the surface of the component has a great influence, the following conditions should be confirmed before use: the amount of flux should be less than or equal to 0.1% of the weight content of the halide (equivalent to the chlorine content). The strong acid contained in the flux should be avoided. When soldering the component to the substrate, the amount of flux used should be controlled at the optimal level. When using water-soluble flux, special care should be taken to clean the substrate.
6. Welding: Rosin flux with mild activity is welcome. Under the good bond that can be obtained, use the least amount of flux as much as possible. Excessive solder will cause stress and damage due to the difference in expansion coefficients of solder, chip and substrate. Kodak’s end faces are suitable for wave soldering and reflow systems. If manual welding is inevitable, it is best to use a welding tool that uses hot air.
1. Storage: In order to maintain the solderability of the end surface electrode, such as: temperature and humidity conditions are less than 40 ℃ and 70% RH. It is recommended that ceramic chip inductors should be used within 6 months after delivery. Packaging materials should avoid environments containing chlorine and sulfur.
2. Handling: It is recommended to separate the used tweezers and vacuum components from other components when picking up. Attention should be paid to minimize friction and mechanical shock during bulk handling. The chip ceramic induction is handled carefully to avoid damage and oil pollution from the skin.
3. Pad design: The design of the electrode's welding pad should be able to achieve good welding paint and reduce the movement of components during reflow. The following is the welding pad design for wave soldering or reflow soldering for the most common dust-collecting ceramic sizes. The basics of these designs are as follows: the width of the welding pad is the same as the width of the component. Reducing to 85% of the component width is permissible, but it is not wise to reduce more. The welding pad overlaps the bottom of the component by 0.5mm. For reflow soldering, the welding pad extends 0.5mm beyond the component; for wave soldering it is 1.0mm longer. Component spacing: For wave soldering components, there must be enough spacing to avoid it. The interval is less important for reflow, but there must be enough interval to prevent heavy work.
4. Preheating: It is very important to avoid the possibility of thermal shock during welding, so preheating is necessary. The preheating temperature rise should not exceed 4°C
c, and the recommended value is 2°Cc. Although a temperature difference of 80°C to 120°C is common, recent studies have shown that for a 1210 size component with a thickness of less than 1.25mm, the difference between the surface temperature of the component and the soldering temperature of up to 150°C is feasible. Users should be aware that thermal shock will increase as the component size or temperature increases.5. The selection of flux: Since the flux returning to the surface of the component has a great influence, the following conditions should be confirmed before use: the amount of flux should be less than or equal to 0.1% of the weight content of the halide (equivalent to the chlorine content). The strong acid contained in the flux should be avoided. When soldering the component to the substrate, the amount of flux used should be controlled at the optimal level. When using water-soluble flux, special care should be taken to clean the substrate.
6. Welding: Rosin flux with mild activity is welcome. Under the good bond that can be obtained, use the least amount of flux as much as possible. Excessive solder will cause stress and damage due to the difference in expansion coefficients of solder, chip and substrate. Kodak’s end faces are suitable for wave soldering and reflow systems. If manual welding is inevitable, it is best to use a welding tool that uses hot air.